TY  - BOOK
AU  - Ma,Yongsheng
ED  - SpringerLink (Online service)
TI  - Progressive and Integrative Ideas and Applications of Engineering Systems Under the Framework of IOT and AI: Proceedings of 2nd International Conference on Intelligent Systems Design and Engineering Applications 
T2  - Lecture Notes in Electrical Engineering,
SN  - 9789819963034
AV  - Q334-342 
PY  - 2024///
CY  - Singapore
PB  - Springer Nature Singapore, Imprint: Springer
KW  - Artificial intelligence
KW  - Engineering design
KW  - Industrial engineering
KW  - Production engineering
KW  - Electric power distribution
KW  - Computational intelligence
KW  - Artificial Intelligence
KW  - Engineering Design
KW  - Industrial and Production Engineering
KW  - Energy Grids and Networks
KW  - Computational Intelligence
KW  - Intelligence Infrastructure
N1  - Forward -- Preface -- Conference -- Committees -- Part I Theory and Application of Artificial Intelligence Technologies in Industry -- Part II System Design and Data Analysis within the Context of Internet of Things (IOT) -- Part III System Automation, Control, and Robots -- Part IV Smart Product Design and Integrated Manufacturing -- Part V Sensors, Transducers and detection technology -- Index
N2  - This volume of proceedings contains peer reviewed papers presented at 2023 International Conference on Intelligent Systems Design and Engineering Applications which was held in Okayama, Japan, May 12-14, 2023 (ISDEA2023). There are five major sessions covered in this book, including 1) Theory and Application of Artificial Intelligence Technologies in Industry; 2) System Design and Data Analysis within the Context of Internet of Things (IOT) ; 3) System Automation, Control, and Robots; 4) Smart Product Design and Integrated Manufacturing and 5) Sensors, Transducers and detection technology. This conference provides an idea-exchange and discussion platform for the world's engineers and academia to share cutting-edge information, address the hottest issue in intelligent systems design and engineering applications, explore new technologies, exchange and build upon ideas
UR  - https://doi.org/10.1007/978-981-99-6303-4
ER  -