@book{60094,
	author = {Lau, John H. and SpringerLink (Online service)},
	title = {Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology},
	publisher = {Springer Nature Singapore :},
	year = {2024.},
	address = {Singapore :},
	edition = {1st ed. 2024.},
	url = {https://doi.org/10.1007/978-981-97-2140-5}
}