02910nam a22005415i 4500 978-981-97-2140-5 DE-He213 20251030112057.0 cr nn 008mamaa 240523s2024 si | s |||| 0|eng d 9789819721405 978-981-97-2140-5 10.1007/978-981-97-2140-5 doi TK7800-8360 TJF bicssc TEC008000 bisacsh TJF thema Lau, John H. author. aut http://id.loc.gov/vocabulary/relators/aut 77366 Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology [electronic resource] / by John H. Lau. 1st ed. 2024. Singapore : Springer Nature Singapore : Imprint: Springer, 2024. XX, 501 p. 556 illus., 520 illus. in color. online resource. text txt rdacontent computer c rdamedia online resource cr rdacarrier text file PDF rda -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics. This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc. Electronics. 65899 Solid state physics. Lasers. 66078 Optics. 66607 Electronics and Microelectronics, Instrumentation. 65902 Electronic Devices. Laser Technology. 66080 Optics and Photonics. 67319 SpringerLink (Online service) Springer Nature eBook Printed edition: 9789819721399 Printed edition: 9789819721412 Printed edition: 9789819721429 https://doi.org/10.1007/978-981-97-2140-5 ZDB-2-ENG ZDB-2-SXE 60094 60094