Lau, John H. creator author. aut http://id.loc.gov/vocabulary/relators/aut SpringerLink (Online service) text si 2024 1st ed. 2024. monographic eng

electronic

electronic resource

access XX, 501 p. 556 illus., 520 illus. in color. online resource. This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc. -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics. by John H. Lau. Electronics Solid state physics Lasers Optics Electronics and Microelectronics, Instrumentation Electronic Devices Laser Technology Optics and Photonics TK7800-8360 9789819721405 https://doi.org/10.1007/978-981-97-2140-5 https://doi.org/10.1007/978-981-97-2140-5 240523 20251030112057.0 978-981-97-2140-5