<?xml version="1.0" encoding="UTF-8"?>
<record
    xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
    xsi:schemaLocation="http://www.loc.gov/MARC21/slim http://www.loc.gov/standards/marcxml/schema/MARC21slim.xsd"
    xmlns="http://www.loc.gov/MARC21/slim">

  <leader>04370nam a22005415i 4500</leader>
  <controlfield tag="001">978-3-031-59361-1</controlfield>
  <controlfield tag="003">DE-He213</controlfield>
  <controlfield tag="005">20251030112624.0</controlfield>
  <controlfield tag="007">cr nn 008mamaa</controlfield>
  <controlfield tag="008">240712s2024    sz |    s    |||| 0|eng d</controlfield>
  <datafield tag="020" ind1=" " ind2=" ">
    <subfield code="a">9783031593611</subfield>
    <subfield code="9">978-3-031-59361-1</subfield>
  </datafield>
  <datafield tag="024" ind1="7" ind2=" ">
    <subfield code="a">10.1007/978-3-031-59361-1</subfield>
    <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="050" ind1=" " ind2="4">
    <subfield code="a">TK7867-7867.5</subfield>
  </datafield>
  <datafield tag="072" ind1=" " ind2="7">
    <subfield code="a">TJFC</subfield>
    <subfield code="2">bicssc</subfield>
  </datafield>
  <datafield tag="072" ind1=" " ind2="7">
    <subfield code="a">TEC008010</subfield>
    <subfield code="2">bisacsh</subfield>
  </datafield>
  <datafield tag="072" ind1=" " ind2="7">
    <subfield code="a">TJFC</subfield>
    <subfield code="2">thema</subfield>
  </datafield>
  <datafield tag="245" ind1="1" ind2="0">
    <subfield code="a">Recent Advances in Microelectronics Reliability</subfield>
    <subfield code="h">[electronic resource] :</subfield>
    <subfield code="b">Contributions from the European ECSEL JU project iRel40 /</subfield>
    <subfield code="c">edited by Willem Dirk van Driel, Klaus Pressel, Mujdat Soyturk.</subfield>
  </datafield>
  <datafield tag="250" ind1=" " ind2=" ">
    <subfield code="a">1st ed. 2024.</subfield>
  </datafield>
  <datafield tag="264" ind1=" " ind2="1">
    <subfield code="a">Cham :</subfield>
    <subfield code="b">Springer International Publishing :</subfield>
    <subfield code="b">Imprint: Springer,</subfield>
    <subfield code="c">2024.</subfield>
  </datafield>
  <datafield tag="300" ind1=" " ind2=" ">
    <subfield code="a">XIII, 403 p. 196 illus., 171 illus. in color.</subfield>
    <subfield code="b">online resource.</subfield>
  </datafield>
  <datafield tag="336" ind1=" " ind2=" ">
    <subfield code="a">text</subfield>
    <subfield code="b">txt</subfield>
    <subfield code="2">rdacontent</subfield>
  </datafield>
  <datafield tag="337" ind1=" " ind2=" ">
    <subfield code="a">computer</subfield>
    <subfield code="b">c</subfield>
    <subfield code="2">rdamedia</subfield>
  </datafield>
  <datafield tag="338" ind1=" " ind2=" ">
    <subfield code="a">online resource</subfield>
    <subfield code="b">cr</subfield>
    <subfield code="2">rdacarrier</subfield>
  </datafield>
  <datafield tag="347" ind1=" " ind2=" ">
    <subfield code="a">text file</subfield>
    <subfield code="b">PDF</subfield>
    <subfield code="2">rda</subfield>
  </datafield>
  <datafield tag="505" ind1="0" ind2=" ">
    <subfield code="a">Chapter 1. Material characterization -- Chapter 2. Smart optical inline metrology -- Chapter 3. Automated classification of semiconductor defect density SEM images using deep learning -- Chapter 4. An Artificial Intelligence-based Framework for Burn-in Reduction in the Semiconductor Manufacturing Industry -- Chapter 5. An Artificial Intelligence-based Framework for Burn-in Reduction in the Semiconductor Manufacturing Industry -- Chapter 6. Early Lifetime Estimation for Automotive Lidar using Realistic L4 Usage Profiles -- Chapter 7. Improving the reliability of automotive sensors -- Chapter 8. Reliability improvements for in-wheel motor -- Chapter 9. Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing -- Chapter 10. An Outlook on Power Electronics Reliability and Reliability Monitoring -- Chapter 11. Digital Twin Technology in Electronics -- Chapter 12. A Framework for Applying Data-driven AI/ML Models in Reliability. Chapter 13. Health monitoring fatigue properties of solder Interconnects in LED drivers -- Chapter 14. Compiling Hybrid Models for embedded architectures using TensorflowLite for Microcontrollers -- Chapter 15. Design support for reliable integrated circuits -- Chapter 16. Outlook: the future of reliability.</subfield>
  </datafield>
  <datafield tag="520" ind1=" " ind2=" ">
    <subfield code="a">This book describes the latest progress in reliability analysis of microelectronic products. The content grows out of an EU project, named Intelligent Reliability 4.0 - iRel40 (see www.irel40.eu ). Different industrial sectors and topics are covered, such as electronics in automotive, rail transport, lighting and personal appliances. Several case studies and examples are discussed, which will enable readers to assess and mitigate similar failure cases. More importantly, this book tries to present methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of electronic devices. Describes state-of-the-art methodologies for analyzing the reliability, failure, and degradation of electronic devices; Discusses how to correlate electronic processing and performance to reliability and lifetime; Provides an overview of simulation techniques and methodologies to predict lifetime and reliability of electronic devices.</subfield>
  </datafield>
  <datafield tag="650" ind1=" " ind2="0">
    <subfield code="a">Electronic circuits.</subfield>
  </datafield>
  <datafield tag="650" ind1=" " ind2="0">
    <subfield code="a">Electronic circuit design.</subfield>
    <subfield code="9">66119</subfield>
  </datafield>
  <datafield tag="650" ind1=" " ind2="0">
    <subfield code="a">Solid state physics.</subfield>
  </datafield>
  <datafield tag="650" ind1="1" ind2="4">
    <subfield code="a">Electronic Circuits and Systems.</subfield>
  </datafield>
  <datafield tag="650" ind1="2" ind2="4">
    <subfield code="a">Electronics Design and Verification.</subfield>
    <subfield code="9">66120</subfield>
  </datafield>
  <datafield tag="650" ind1="2" ind2="4">
    <subfield code="a">Electronic Devices.</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
    <subfield code="a">van Driel, Willem Dirk.</subfield>
    <subfield code="e">editor.</subfield>
    <subfield code="4">edt</subfield>
    <subfield code="4">http://id.loc.gov/vocabulary/relators/edt</subfield>
    <subfield code="9">80399</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
    <subfield code="a">Pressel, Klaus.</subfield>
    <subfield code="e">editor.</subfield>
    <subfield code="4">edt</subfield>
    <subfield code="4">http://id.loc.gov/vocabulary/relators/edt</subfield>
    <subfield code="9">80400</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
    <subfield code="a">Soyturk, Mujdat.</subfield>
    <subfield code="e">editor.</subfield>
    <subfield code="4">edt</subfield>
    <subfield code="4">http://id.loc.gov/vocabulary/relators/edt</subfield>
    <subfield code="9">80401</subfield>
  </datafield>
  <datafield tag="710" ind1="2" ind2=" ">
    <subfield code="a">SpringerLink (Online service)</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
    <subfield code="t">Springer Nature eBook</subfield>
  </datafield>
  <datafield tag="776" ind1="0" ind2="8">
    <subfield code="i">Printed edition:</subfield>
    <subfield code="z">9783031593604</subfield>
  </datafield>
  <datafield tag="776" ind1="0" ind2="8">
    <subfield code="i">Printed edition:</subfield>
    <subfield code="z">9783031593628</subfield>
  </datafield>
  <datafield tag="776" ind1="0" ind2="8">
    <subfield code="i">Printed edition:</subfield>
    <subfield code="z">9783031593635</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
    <subfield code="u">https://doi.org/10.1007/978-3-031-59361-1</subfield>
  </datafield>
  <datafield tag="912" ind1=" " ind2=" ">
    <subfield code="a">ZDB-2-ENG</subfield>
  </datafield>
  <datafield tag="912" ind1=" " ind2=" ">
    <subfield code="a">ZDB-2-SXE</subfield>
  </datafield>
  <datafield tag="999" ind1=" " ind2=" ">
    <subfield code="c">61522</subfield>
    <subfield code="d">61522</subfield>
  </datafield>
</record>
