03247nam a22004094u 4500 10.1002/9781119179283 Wiley 20251030120305.0 cr nn 008mam|a 240531t2024||||xxu fs| |0|| 0|eng|| 9781119179283 electronic 10.1002/9781119179283 doi eng Luo, Xiaobing aut 91395 Thermal Management for Opto‐electronics Packaging and Applications [electronic resource] Xiaobing Luo, Run Hu, Bin Xie 1 Wiley 2024 Wiley 2024 368pp.; text txt rdacontent computer c rdamedia online resource cr rdacarrier text file rdaft PDF A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design. Electronic Packaging 91396 Thermal Protection Engineering 91397 Power Electronics Thermal convection; thermal radiation; opto-thermal coupled modeling; thermal interfacial materials; thermal management for LEDs; hybrid thermal management; downhole devices; liquid cooling for high-heat-flux electronic devices Hu, Run aut 91398 Xie, Bin aut 91399 Printed edition: 9781119179276 https://doi.org/10.1002/9781119179283 Wiley Online Library https://onlinelibrary.wiley.com/action/showBook?doi=10.1002%2F9781119179283 Wiley Online Library Cover Image https://onlinelibrary.wiley.com/cms/asset/7f2b7182-5457-421e-bf17-c3eaf2ad73bc/9781119179283.cover.gif Wiley Online Library 66941 66941