03359nam a22003974u 4500 10.1002/9783527845729 Wiley 20251030120311.0 cr nn 008mam|a 240416t2024||||xxu fs| |0|| 0|eng|| 9783527845729 electronic 10.1002/9783527845729 doi eng Flexible Electronic Packaging and Encapsulation Technology [electronic resource] Edited by Hong Meng, Wei Huang. 1 Wiley 2024 Wiley 2024 384pp.; text txt rdacontent computer c rdamedia online resource cr rdacarrier text file rdaft PDF Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems. Electronic Materials 67191 Components & Devices 91173 Semiconductor Physics 91462 Flexible electronic technology; heat dissipation; energy vehicles; Internet of Things; healthcare technology; flexible substrate; hard thin films; Island-bridge structure; super-soft interconnect structure; inkjet packaging; multilayer film Meng, Hong edt 91172 Huang, Wei edt 85946 Printed edition: 9783527353590 https://doi.org/10.1002/9783527845729 Wiley Online Library https://onlinelibrary.wiley.com/action/showBook?doi=10.1002%2F9783527845729 Wiley Online Library Cover Image https://onlinelibrary.wiley.com/cms/asset/a709a372-0975-4ca6-8b55-74cdf1b986ee/9783527845729.cover.gif Wiley Online Library 67072 67072