03799nam a22003614u 450000100220000000300060002200500170002800700150004500800410006002000300010102400310013104100080016224501500017025000060032026000160032626400160034230000120035833600260037033700260039633800360042234700210045834700080047952023000048765000320278765000320281965000330285165302260288470000300311077600360314085601020317685601420327899900170342010.1002/9783527843121Wiley20251030120316.0cr nn 008mam|a240104t2024||||xxu    fs|   |0|| 0|eng||  a9783527843121qelectronic7 a10.1002/97835278431212doi  aeng00aThermal Management Materials for Electronic PackagingbPreparation, Characterization, and Devicesh[electronic resource]cEdited by Xingyou Tian.  a1  bWileyc2024 1bWileyc2024  a368pp.;  atextbtxt2rdacontent  acomputerbc2rdamedia  aonline resourcebcr2rdacarrier  atext file2rdaft  bPDF  aThermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients. 4aElectronic Materials967191 4aComponents & Devices991173 4aSemiconductor Physics99146200athermal management materials; high-power density electronic devices; thermal conductivity theory; thermal performance prediction models; multiphase composites; high thermal conductive substrate materials; spatial topology1 aTian, Xingyou4edt99206008iPrinted edition:z978352735242540uhttps://onlinelibrary.wiley.com/action/showBook?doi=10.1002%2F9783527843121aWiley Online Library423Cover Imageuhttps://onlinelibrary.wiley.com/cms/asset/f1fb7d8a-4afb-4ec7-a820-cbe5d67b4112/9783527843121.cover.gifaWiley Online Library  c67200d67200