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  <titleInfo>
    <title>Thermal properties of nanofluids</title>
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  <name type="personal">
    <namePart>Armaghani, Taher</namePart>
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  <name type="personal">
    <namePart>Ghasemiasl, Ramin</namePart>
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  <name type="personal">
    <namePart>Mahian, Omid</namePart>
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    <dateIssued encoding="marc">2025</dateIssued>
    <edition>First edition.</edition>
    <issuance>monographic</issuance>
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  <language>
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  <abstract>"Thermal Properties of Nanofluids presents emerging prospects of understanding and controlling thermophysical properties at the nanoscale. It covers a comprehensive study of recent progress concerning these properties from the solid state to colloids and, above all, a different look at the effect of temperature on nanofluids thermal conducting. Introducing various techniques for measuring solid-state properties, including thermal conductivity, thermal diffusivity, and specific heat capacity, the book presents modeling approaches developed for predicting these properties by molecular dynamic (MD) simulations. It discusses the main factors that affect solid-state properties, such as grain size, grain boundaries, surface interactions, doping, and temperature, and the effects of all these factors. The book will interest industry professionals and academic researchers studying the thermophysical behavior of nanomaterials and heat transfer applications of nanofluids. It will serve graduate engineering students studying advanced fluid mechanics, heat transfer, and nanomaterials"--</abstract>
  <tableOfContents>An Overview of nanoscience -- Defining solid and colloidal nanomaterials -- The benefits and drawbacks of nanostructured materials.</tableOfContents>
  <note type="statement of responsibility">Taher Armaghani, Ramin Ghasemiasl, and Omid Mahian.</note>
  <subject authority="lcsh">
    <topic>Nanofluids</topic>
    <topic>Thermal properties</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Nanofluids</topic>
    <topic>Thermal properties</topic>
    <topic>Mathematical models</topic>
  </subject>
  <subject authority="bisacsh">
    <topic>TECHNOLOGY / Engineering / Mechanical</topic>
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  <classification authority="lcc">TJ853.4.M53</classification>
  <identifier type="isbn">9781032664118</identifier>
  <identifier type="isbn">1032664118</identifier>
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