<?xml version="1.0" encoding="utf-8" ?> <rss version="2.0" xmlns:opensearch="http://a9.com/-/spec/opensearch/1.1/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom"> <channel> <title> <![CDATA[Biblioteca Universității &quot;Dunărea de Jos&quot; Search for 'an:91145']]> </title> <!-- prettier-ignore-start --> <link> https://opac.ugal.ro/cgi-bin/koha/opac-search.pl?q=ccl=an%3A91145&#38;sort_by=relevance&#38;format=rss </link> <!-- prettier-ignore-end --> <atom:link rel="self" type="application/rss+xml" href="https://opac.ugal.ro/cgi-bin/koha/opac-search.pl?q=ccl=an%3A91145&#38;sort_by=relevance&#38;format=rss" /> <description> <![CDATA[ Search results for 'an:91145' at Biblioteca Universității &quot;Dunărea de Jos&quot;]]> </description> <opensearch:totalResults>3</opensearch:totalResults> <opensearch:startIndex>0</opensearch:startIndex> <opensearch:itemsPerPage>50</opensearch:itemsPerPage> <atom:link rel="search" type="application/opensearchdescription+xml" href="https://opac.ugal.ro/cgi-bin/koha/opac-search.pl?q=ccl=an%3A91145&#38;sort_by=relevance&#38;format=opensearchdescription" /> <opensearch:Query role="request" searchTerms="q%3Dccl%3Dan%253A91145" startPage="" /> <item> <title> Silicon, From Sand to Chips 2 Microelectronic Chips, Solar Cells, MEMS </title> <dc:identifier>ISBN:9781394297641</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=66874</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Vignes, Alain.<br /> Wiley 2024 .<br /> 192pp.; 9781394297641 </p> ]]> <![CDATA[ <p> <a href="https://opac.ugal.ro/cgi-bin/koha/opac-reserve.pl?biblionumber=66874">Place hold on <em>Silicon, From Sand to Chips 2</em></a> </p> ]]> </description> <guid>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=66874</guid> </item> <item> <title> Thermal Properties Measurement of Materials </title> <dc:identifier>ISBN:9781394335084</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67071</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Jannot, Yves.<br /> Wiley 2024 .<br /> 448pp.; 9781394335084 </p> ]]> <![CDATA[ <p> <a href="https://opac.ugal.ro/cgi-bin/koha/opac-reserve.pl?biblionumber=67071">Place hold on <em>Thermal Properties Measurement of Materials</em></a> </p> ]]> </description> <guid>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67071</guid> </item> <item> <title> Silicon, From Sand to Chips 1 Microelectronic Components </title> <dc:identifier>ISBN:9781394297610</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67233</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Vignes, Alain.<br /> Wiley 2024 .<br /> 256pp.; 9781394297610 </p> ]]> <![CDATA[ <p> <a href="https://opac.ugal.ro/cgi-bin/koha/opac-reserve.pl?biblionumber=67233">Place hold on <em>Silicon, From Sand to Chips 1</em></a> </p> ]]> </description> <guid>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67233</guid> </item> </channel> </rss>
