<?xml version="1.0" encoding="utf-8" ?> <rss version="2.0" xmlns:opensearch="http://a9.com/-/spec/opensearch/1.1/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom"> <channel> <title> <![CDATA[Biblioteca Universității &quot;Dunărea de Jos&quot; Search for 'an:91462']]> </title> <!-- prettier-ignore-start --> <link> https://opac.ugal.ro/cgi-bin/koha/opac-search.pl?q=ccl=an%3A91462&#38;sort_by=relevance&#38;format=rss </link> <!-- prettier-ignore-end --> <atom:link rel="self" type="application/rss+xml" href="https://opac.ugal.ro/cgi-bin/koha/opac-search.pl?q=ccl=an%3A91462&#38;sort_by=relevance&#38;format=rss" /> <description> <![CDATA[ Search results for 'an:91462' at Biblioteca Universității &quot;Dunărea de Jos&quot;]]> </description> <opensearch:totalResults>4</opensearch:totalResults> <opensearch:startIndex>0</opensearch:startIndex> <opensearch:itemsPerPage>50</opensearch:itemsPerPage> <atom:link rel="search" type="application/opensearchdescription+xml" href="https://opac.ugal.ro/cgi-bin/koha/opac-search.pl?q=ccl=an%3A91462&#38;sort_by=relevance&#38;format=opensearchdescription" /> <opensearch:Query role="request" searchTerms="q%3Dccl%3Dan%253A91462" startPage="" /> <item> <title> Metal Oxide Semiconductors Synthesis, Properties, and Devices </title> <dc:identifier>ISBN:9783527842551</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=66963</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> By Zang, Zhigang.<br /> Wiley 2024 .<br /> 288pp.; 9783527842551 </p> ]]> <![CDATA[ <p> <a href="https://opac.ugal.ro/cgi-bin/koha/opac-reserve.pl?biblionumber=66963">Place hold on <em>Metal Oxide Semiconductors</em></a> </p> ]]> </description> <guid>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=66963</guid> </item> <item> <title> Group III‐Nitride Semiconductor Optoelectronics </title> <dc:identifier>ISBN:9781119708681</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67017</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> Wiley 2023 .<br /> 192pp.; 9781119708681 </p> ]]> <![CDATA[ <p> <a href="https://opac.ugal.ro/cgi-bin/koha/opac-reserve.pl?biblionumber=67017">Place hold on <em>Group III‐Nitride Semiconductor Optoelectronics</em></a> </p> ]]> </description> <guid>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67017</guid> </item> <item> <title> Flexible Electronic Packaging and Encapsulation Technology </title> <dc:identifier>ISBN:9783527845729</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67072</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> Wiley 2024 .<br /> 384pp.; 9783527845729 </p> ]]> <![CDATA[ <p> <a href="https://opac.ugal.ro/cgi-bin/koha/opac-reserve.pl?biblionumber=67072">Place hold on <em>Flexible Electronic Packaging and Encapsulation Technology</em></a> </p> ]]> </description> <guid>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67072</guid> </item> <item> <title> Thermal Management Materials for Electronic Packaging Preparation, Characterization, and Devices </title> <dc:identifier>ISBN:9783527843121</dc:identifier> <!-- prettier-ignore-start --> <link>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67200</link> <!-- prettier-ignore-end --> <description> <![CDATA[ <p> Wiley 2024 .<br /> 368pp.; 9783527843121 </p> ]]> <![CDATA[ <p> <a href="https://opac.ugal.ro/cgi-bin/koha/opac-reserve.pl?biblionumber=67200">Place hold on <em>Thermal Management Materials for Electronic Packaging</em></a> </p> ]]> </description> <guid>https://opac.ugal.ro/cgi-bin/koha/opac-detail.pl?biblionumber=67200</guid> </item> </channel> </rss>
