| 000 | 02910nam a22005415i 4500 | ||
|---|---|---|---|
| 001 | 978-981-97-2140-5 | ||
| 003 | DE-He213 | ||
| 005 | 20251030112057.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 240523s2024 si | s |||| 0|eng d | ||
| 020 |
_a9789819721405 _9978-981-97-2140-5 |
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| 024 | 7 |
_a10.1007/978-981-97-2140-5 _2doi |
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| 050 | 4 | _aTK7800-8360 | |
| 072 | 7 |
_aTJF _2bicssc |
|
| 072 | 7 |
_aTEC008000 _2bisacsh |
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| 072 | 7 |
_aTJF _2thema |
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| 100 | 1 |
_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _977366 |
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| 245 | 1 | 0 |
_aFlip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology _h[electronic resource] / _cby John H. Lau. |
| 250 | _a1st ed. 2024. | ||
| 264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2024. |
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| 300 |
_aXX, 501 p. 556 illus., 520 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _a -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics. | |
| 520 | _aThis book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc. | ||
| 650 | 0 |
_aElectronics. _965899 |
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| 650 | 0 | _aSolid state physics. | |
| 650 | 0 |
_aLasers. _966078 |
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| 650 | 0 |
_aOptics. _966607 |
|
| 650 | 1 | 4 |
_aElectronics and Microelectronics, Instrumentation. _965902 |
| 650 | 2 | 4 | _aElectronic Devices. |
| 650 | 2 | 4 |
_aLaser Technology. _966080 |
| 650 | 2 | 4 |
_aOptics and Photonics. _967319 |
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9789819721399 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789819721412 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789819721429 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-981-97-2140-5 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 999 |
_c60094 _d60094 |
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