000			03359nam a22003974u 4500
001			10.1002/9783527845729
003			Wiley
005			20251030120311.0
007			cr nn 008mam|a
008			240416t2024||||xxu fs| |0|| 0|eng||
020			_a9783527845729 _qelectronic
024	7		_a10.1002/9783527845729 _2doi
041			_aeng
245	0	0	_aFlexible Electronic Packaging and Encapsulation Technology _h[electronic resource] _cEdited by Hong Meng, Wei Huang.
250			_a1
260			_bWiley _c2024
264		1	_bWiley _c2024
300			_a384pp.;
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _2rdaft
347			_bPDF
520			_aFlexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
650		4	_aElectronic Materials _967191
650		4	_aComponents & Devices _991173
650		4	_aSemiconductor Physics _991462
653	0	0	_aFlexible electronic technology; heat dissipation; energy vehicles; Internet of Things; healthcare technology; flexible substrate; hard thin films; Island-bridge structure; super-soft interconnect structure; inkjet packaging; multilayer film
700	1		_aMeng, Hong _4edt _991172
700	1		_aHuang, Wei _4edt _985946
776	0	8	_iPrinted edition: _z9783527353590
856	4	0	_uhttps://doi.org/10.1002/9783527845729 _aWiley Online Library
856	4	0	_uhttps://onlinelibrary.wiley.com/action/showBook?doi=10.1002%2F9783527845729 _aWiley Online Library
856	4	2	_3Cover Image _uhttps://onlinelibrary.wiley.com/cms/asset/a709a372-0975-4ca6-8b55-74cdf1b986ee/9783527845729.cover.gif _aWiley Online Library
999			_c67072 _d67072